14 February 2008
A new type of copper wire developed by US scientists could lead to the development of ultra-fast broadband networks, it has been suggested.
Currently, chips and external circuitry within broadband connections are pieced together using a combination of tin solder and glue.
However, new circuits developed by Georgia Tech use copper solder to form an integrated connection - allowing much greater potential network speeds.
This is due, in part, because of the metal's excellent conductivity and the strength of bonds which can be made between copper and copper.
Paul Kohl, Regents Professor at the university's School of Chemical and Biomolecular Engineering, commented: "Circuitry and computer chips are made with copper lines on them, so we thought we should make the connection between the two with copper also."
Graduate student Tyler Osborn, Professor Kohl's partner on the project, added:
"I've…studied the optimal shape for the [copper] connections so that they're flexible and mechanically reliable, yet still have good electrical properties so that we can transmit these high frequency signals."
The project, which is still at an early stage, has already received backing from technology firms Intel and Applied Materials.
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