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Samsung Galaxy S10 set to pack futuristic chipsets

Samsung Galaxy S10 concept wireless charger hero

Samsung looks set to include powerful new smartphone processor tech in its next–generation Galaxy S10 smartphones.

However, local media in the company’s home country of Korea claim that the processors will only be available in selected versions of the Galaxy S10.

Samsung is said to be plotting new Substrate Like PCB (SLP) boards for the S10 models it has in the works.

These can be stacked together tightly, allowing more room for other components, such as larger batteries.

Frustratingly, this approach will only form part of Samsung’s in–house Exynos processors.

That means chips bought from Qualcomm will not pack SLP, meaning they won’t have room for a bigger power pack.

While that will disappoint power users, the same reports from Korea also reveal once more that Samsung is planning on including an in–screen fingerprint scanner within the Galaxy S10, following the OnePlus 6T, which will launch later this month.

Recent rumours point towards Samsung launching three models of its Galaxy S10 next year. One is thought to be a cheaper edition, as Samsung looks to take on Apple’s recently released iPhone XR.

Samsung is set to reveal its trio of new devices at Mobile World Congress next February.

Source:

ET News

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