Skip to main content
Menu
  1. uSwitch.com
  2. News
  3. 2016
  4. April
  5. iPhone 7 set to slim down thanks to new internal component tech

iPhone 7 set to slim down thanks to new internal component tech

-
iPhone 7 set to slim down thanks to new internal component tech

Apple is planning to make the forthcoming iPhone 7 even slimmer, with reports emerging of plans for a new technology designed to shave off millimetres from the device’s frame.

The company is said to be considering using Fan Out Packaging, which is aimed at making processors smaller, hence offering more space inside the device.

This could either be used to ensure the iPhone 7 still has room for the same-sized battery as the iPhone 6s.

Apple is unlikely to use a larger battery, with its Chief Design Officer, Jony Ive, on record as saying he would rather create a thinner iPhone than a larger one which can last longer.

This latest tidbit fits into a wider pattern of stories about Apple’s plans for slimming down its iPhone 7.

The company is set to ditch the traditional 3.5mm headphone jack and instead bundle ear buds which use the device’s Lightning charging port.

This will almost certainly help Apple’s designers when it comes to offering a thinner handset.

Apple is set to release the iPhone 7 in autumn, with rumours already swirling about its wider plans for a much–improved dual lens camera and a design which dispenses with the plastic antenna bands that have featured on the back of recent iPhones.

Source:

BGR

Sign up for updates

Join our email list to get the inside line on the latest phones and money-saving offers. And we’ll help you make informed buying decisions with handset reviews and consumer guides too.

Latest news:

Sign up for updates

Join our email list to get the inside line on the latest phones and money-saving offers. And we’ll help you make informed buying decisions with handset reviews and consumer guides too.

back to top